Principal/Sr. Principal ECAD Designer

Delivering mission-critical, electronic solutions that protect lives. Use your creativity and critical thinking to take our products from concept to customer.

At CAES, we engineer solutions for the world’s most critical missions. We serve customers in the defense and aerospace markets.

Seeking a career that offers challenging, diverse projects and opportunities? Looking for a position with a company that offers long-term professional advancement? Searching for a place that values a diverse, team-based environment? One that values YOU. Consider CAES.

The most important thing we build is TRUST

Perform independent circuit board design and layout tasks for moderate to highly complex multi-layer mixed mode circuit boards. Utilize established company design guidelines and industry standards with ECAD and MCAD design tools such as PADS AutoCAD and SolidWorks for design. Adhere to established engineering drafting practices. Draw and revise detailed fabrication, assembly and installation drawings from layouts, and engineering change orders. Contributes to design modifications to improve the quality of existing products or to facilitate manufacturing operations.

• Generate circuit board layouts and drawings from engineering inputs (schematics, block diagrams, flow charts) using ECAD and MCAD software.
• Interact with RF engineers to convert EM simulations into precise copper shapes (RF PCB elements) and provide PCB layout outputs for EM verification and PCB routing for impedance control.
• Recommend selection of component hardware, printed circuit board material, layer stacks, IPC criteria, tooling and metal fabrication.
• Prepare parts lists and enter parts list data into PLM systems.
• Experience creating PCB drawings to company and IPC standards.
• Experience in detailed error checking (DRC/DFM), conducting design reviews and customer presentations, along with releasing fabrication and assembly packages to inside and outside manufacturers.
• Interface with Engineering to define mechanical assembly approaches for manufacturing and production.
• Understand basic engineering calculations for line impedance, temperature rise and voltage drop in RF and DC circuits.
• Incorporate engineering change orders to designs, including hybrid designs, using PADS, AutoCAD or SolidWorks.
• Actively comply with all company safety policies and practices.
• Participate in Lean/Six Sigma activities in own work area as well as events for other areas to enhance cross-functional problem solving.
• Collaborate in team meetings and activities.
• Performs other job-related duties as assigned.

Minimum:

• Associate’s degree in Drafting or equivalent experience in schematics and electro-mechanical design.
• Eight (8) or more years of related experience designing high frequency products that utilize multilayer mixed mode SMT circuit board design along with chip and wire (MIC) design approaches.
• A comprehensive knowledge of the IPC (Institute for Interconnecting and Packaging Electronic Circuits) 2220 series of standards associated with CCA and PCB design.
• A strong knowledge of electronics packaging.
• An understanding of metal fabrication, electronics assembly and electronics manufacturing flow.
• A comprehensive knowledge of ASME Y 14.5 and related drawing specifications.
• A comprehensive knowledge of ASME Y 14.100 and related drawing specifications.
• Expertise in dimensioning and tolerancing. A strong working knowledge of GD&T (Geometric Dimensioning and Tolerancing).
• The ability to review and compare engineering inputs and drawings to identify inconsistencies and determine when corrections as needed.
• The ability to use computer-aided design software suites including AutoCAD, SolidWorks and PADS.
• This position requires access to technology, materials, software or hardware that is controlled by US export law. In order to be eligible for this position, you must be a "US Person" under US export laws (or eligible for approval under a U.S. Government export license)
• Ability to obtain and maintain a security clearance.

Preferred:

• Bachelor’s Degree in Electronics or a related field or equivalent experience
• Eleven (11) or more years of related experience in electro-mechanical packaging and circuit board design
• A comprehensive knowledge of IPC (Institute for Interconnecting and Packaging Electronic Circuits) standards associated with PCB design.
• CID or CID+ Certification a plus
• Expertise using multiple ECAD and MCAD packages a plus.
• Experience with mixed mode, multilayer PCB (Printed Circuit Board) design
• Experience in MIC (Microwave Integrated Circuit) design, packaging and processes
• Experience in microwave or millimeter wave electronics packaging design
• Experience in MCM (Multi-chip Module) packaging
• SAP or Agile experience
• The ability to work effectively as a part of an integrated design team.
• The ability to be flexible and adapt to changing priorities and work assignments.
• The ability to present information and speak effectively.
• The ability to communicate across organizational levels with quality, integrity and respect.

Salary Range: $ 108,134 - $ 205,573 annually (San Diego).

Employees may be eligible for a discretionary bonus in addition to base bay. Applicable pay within the posted range may vary based on factors including, but not limited to, geographical location, job function of the position, education, and experience of the successful candidate. CAES provides a variety of benefits including health insurance coverage, life and disability insurance, 401K, paid holidays and vacation.

EMPLOYMENT TRANSPARENCY

BENEFITS

We take care of our people and provide competitive health, wealth and wellbeing benefits – from day one. You’ll also discover learning and development opportunities so you can take your career to the next level – and beyond.

Other benefits include:

• Comprehensive PTO, Paid Holiday and Paid Family Leave Programs.
• Student Loan Repayment Program & Tuition Reimbursement
• 9/80 Alternate Work Week Schedule - Every Other Friday is an Off-Friday
• Tailored Management/Leadership Training
• Innovative Medical Programs, Including Family Forming

ABOUT CAES

CAES is the largest provider of analog and radiation hardened technology for the United States aerospace and defense industry. From human spaceflight and space exploration, to missile defense and electronic warfare, to healthcare solutions addressing COVID-19, our talented team develop high performing electronic solutions that work the first time, every time.

WE ARE AN EQUAL OPPORTUNITIES EMPLOYER

At CAES we welcome differences and celebrate new ideas. We believe the diversity of our people inspires our creativity and drives our innovation. Everyone is welcome here, regardless of race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or genetic information.

We are committed to working with and providing reasonable accommodations to individuals with disabilities. If you need a reasonable accommodation due to a disability for any part of the employment process, please email CAEScareers@caes.com.